技術服務

                  Design services

                  來源: 發布時間:2016-4-15 16:21:48 瀏覽次數:0

                     

                  HuaTian Package Design Team has totel 15 members, all have rich experience that can help customers determine the optimum package for complex integrated circuits, assist customers in designing a package substrate to meet the customer's power, ground and I/O requirements for each pin and conduct thermal and electrical simulations.

                      Package Design Team services include:

                  ?  Customer-centric design.

                  ?  High quality, reliable, and cost effective packaging proposal.

                  ?  DFM (Design For Manufacturing) and DFC (Design for Cost).

                  ?  Supporting auto- check of design and Drawings.

                  Design Capabilities:

                     Multi-Chip ModulesMCM

                     System-in-Package (SiP)

                     Flip Chip Package

                     Hybrid Package

                     Package-in-Package (PiP)

                     Package-on-Package (PoP)

                     Embedded Package

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